BW Businessworld · 7h ago
BW Businessworld · 7小时前
Sony and TSMC are planning a $6.3 billion joint venture for next-generation image sensors. If completed, the project would pair Sony's sensor franchise with TSMC's manufacturing scale and deepen the foundry's exposure to specialty imaging silicon beyond leading-edge logic. The report describes a plan, so ownership, location, process mix, and construction timing remain key open details.
Sony与TSMC计划成立规模达$6.3B的合资项目，生产下一代图像传感器。若项目落地，Sony的传感器业务将与TSMC的制造规模结合，也会让后者在先进逻辑之外进一步扩大特色图像芯片业务。报道目前仍停留在计划阶段，股权、选址、制程组合和建设时间仍是关键待定项。
gasworld · 9h ago
gasworld · 9小时前
Chinese foundries recorded triple-digit quarterly growth, according to gasworld. The acceleration points to a sharp domestic manufacturing ramp, with implications for mature-node supply, industrial-gas demand, and equipment utilization. The candidate report does not specify whether the growth measure is revenue, output, or another operating metric, so the headline rate should not be read as a direct capacity figure.
据gasworld报道，中国晶圆代工厂录得季度三位数增长。这一加速势头指向国内制造快速爬坡，并将影响成熟制程供给、工业气体需求和设备利用率。候选报道未说明增长口径是收入、产量还是其他运营指标，因此不能把标题中的增速直接等同于产能增幅。
DigiTimes · 1h ago
DigiTimes · 1小时前
Rapidus is targeting interposers spanning eight reticles by 2030. That scale would support much larger multi-chip packages and reflects how advanced packaging is becoming part of the foundry roadmap, not a downstream afterthought. The date is a target rather than a production commitment, leaving process readiness, yield, and customer qualification to be demonstrated.
Rapidus计划到2030年实现覆盖八倍光罩尺寸的中介层。这一尺寸可承载更大的多芯片封装，也表明先进封装已进入晶圆代工路线图核心，而不再只是后段配套。2030年仍是目标而非量产承诺，工艺成熟度、良率和客户认证仍有待验证。