SK hynix puts cooling inside the HBM stack with 'iHBM' — 30% lower thermal resistance, targeted at HBM5 SK海力士将散热结构嵌入HBM内部：'iHBM'热阻降低30%，瞄准HBM5
SK hynix unveiled iHBM, embedding silicon-based Integrated Cooling Elements (ICEs) directly into the D2D PHY region between HBM and the GPU — where heat is most concentrated — using its Mass Reflow Molded Underfill (MR-MUF) wafer-level packaging. The company quotes a 30% reduction in thermal resistance versus conventional HBM and slates the technology for next-generation parts including HBM5. The move recasts the memory wall as a thermal wall: with HBM3E/HBM4 stacks already throttling GPU performance at high duty cycles, integrated cooling becomes the gating supplier capability rather than just stack height or I/O speed. SK海力士发布iHBM技术，将硅基集成冷却元件（ICE）直接嵌入HBM与GPU之间热量最集中的D2D PHY区域，并通过其大量回流模塑底部填充（MR-MUF）晶圆级封装实现量产。官方数据称热阻较常规HBM下降30%，并将率先用于下一代HBM5。这把'存储墙'重新定义为'热墙'：当HBM3E/HBM4在高负载下已开始限制GPU性能时，集成散热将成为新的关键供应商能力，超越堆叠层数或I/O速率本身。